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1

Effects of film thickness and deposition rate on the diffusion barrier performance of titanium nitride in Cu-through silicon vias

Lee, Young-Joo, Yeon, Han-Wool, Jung, Sung-Yup, Na, Se-Kwon, Park, Jong-Seung, Choi, Yong-Yoon, Lee, Hoo-Jeong, Song, Oh-Sung, Joo, Young-Chang

Journal:

Electronic Materials Letters

Year:

2014

Language:

english

File:

PDF, 720 KB

english, 2014

2

Electromigration Characteristics and Morphological Evolution of Cu Interconnects on CVD Co and Ru Liners for 10 nm Class VLSI Technology

Jang, Kyung-Tae, Lee, So-Yeon, Na, Se-Kwon, Lee, Sol-Kyu, Baek, Jong-Min, You, Woo-Kyung, Park, Ok-Hee, Kim, Rak-Hwan, Oh, Hyeok-Sang, Joo, Young-Chang

Journal:

IEEE Electron Device Letters

Year:

2018

Language:

english

File:

PDF, 485 KB

english, 2018

3

A model for hillock growth in Al thin films controlled by plastic deformation

Soo-Jung Hwang, William D. Nix, Young-Chang Joo

Journal:

Acta Materialia

Year:

2007

Language:

english

File:

PDF, 231 KB

english, 2007

4

Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding

Min, Hong-Seok, Joo, Young-Chang, Song, Oh-Sung

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 450 KB

english, 2004

5

Electrophoretic kinetics of concentrated TiO2 nanoparticle suspensions in aprotic solvent

Lee, So-Yeon, Yim, Jung-Ryoul, Lee, Se-Hee, Choi, In-Suk, Nam, Ki Tae, Joo, Young-Chang

Journal:

Electronic Materials Letters

Year:

2018

Language:

english

File:

PDF, 956 KB

english, 2018

6

Effects of interfacial layer-by-layer nanolayers on the stability of the Cu TSV: Diffusion barrier, adhesion, conformal coating, and mechanical property

Jeong, Daekyun, Abdur, Rahim, Joo, Young-Chang, Jang, Jae-il, Cha, Pil Ryung, Kim, Jiyoung, Min, Kyeong-Sik, Lee, Jaegab

Journal:

Materials Science in Semiconductor Processing

Year:

2018

Language:

english

File:

PDF, 2.58 MB

english, 2018

7

Extremely Versatile Deformability beyond Materiality: A New Material Platform through Simple Cutting for Rugged Batteries

Kim, Kee-Bum, Lee, Young-Joo, Costa, Avelino, Lee, Yu-Ki, Jang, Tae-Sik, Lee, Myoung-Gyu, Joo, Young-Chang, Oh, Kyu Hwan, Song, Juha, Choi, In-Suk

Journal:

Advanced Engineering Materials

Year:

2019

File:

PDF, 1.73 MB

2019

8

Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate

Lee, Dong-Jun, Lee, Jong-Sung, Kim, Tae-Wook, Lee, So-Yeon, Park, Young-Bae, Joo, Young-Chang, Kim, Byoung-Joon

Journal:

Journal of Electronic Materials

Year:

2019

Language:

english

File:

PDF, 3.55 MB

english, 2019

9

Effect of capping layer and post-CMP surface treatments on adhesion between damascene Cu and capping layer for ULSI interconnects

Seol-Min Yi, Cheonman Shim, Han-Choon Lee, Jae-Won Han, Kee-Ho Kim, Young-Chang Joo

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 378 KB

english, 2008

10

Effect of the composition of Sn-Pb alloys on the microstructure of filaments and the electrochemical migration characteristics

Shin-Bok Lee, Ho-Young Lee, Min-Suk Jung, Young-Bae Park, Young-Chang Joo

Journal:

Metals and Materials International

Year:

2011

Language:

english

File:

PDF, 861 KB

english, 2011

11

The self-formatting barrier characteristics of Cu–Mg/SiO2 and Cu–Ru/SiO2 films for Cu interconnects

Seol-Min Yi, Kwang-Ho Jang, Jung-Uk An, Sang-Soo Hwang, Young-Chang Joo

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 523 KB

english, 2008

12

Fatigue-Free, Electrically Reliable Copper Electrode with Nanohole Array

Byoung-Joon Kim, Yigil Cho, Min-Suk Jung, Hae-A-Seul Shin, Myoung-Woon Moon, Heung Nam Han, Ki Tae Nam, Young-Chang Joo, In-Suk Choi

Journal:

Year:

2012

Language:

english

File:

PDF, 1.61 MB

english, 2012

13

Effect of film thickness and annealing temperature on hillock distributions in pure Al films

Soo-Jung Hwang, Je-Hun Lee, Chang-Oh Jeong, Young-Chang Joo

Journal:

Scripta Materialia

Year:

2007

Language:

english

File:

PDF, 397 KB

english, 2007

14

Effect of Bias Voltage on the Electrochemical Migration Behaviors of Sn and Pb

Shin-Bok Lee,, Min-Suk Jung,, Ho-Young Lee,, Tak Kang,, Young-Chang Joo,

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2009

Language:

english

File:

PDF, 736 KB

english, 2009

15

Improvement of Electrochemical Migration Resistance by Cu/Sn Intermetallic Compound Barrier on Cu in Printed Circuit Board

Jung, Min-Suk, Lee, Shin-Bok, Lee, Ho-Young, Ryu, Chang-Sup, Ko, Young-Gwan, Park, Hyung-Wook, Joo, Young-Chang

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.18 MB

english, 2014

16

[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Electrical failure and damage analysis of multi-layer metal films on flexible substrate during cyclic bending deformation

Byoung-Joon Kim,, Hae-A-Seul Shin,, In-Suk Choi,, Young-Chang Joo,

Year:

2011

Language:

english

File:

PDF, 1.07 MB

english, 2011

17

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Intermetallic compound and Kirkendall void growth in Cu pillar bump during annealing and current stressing

Byoung-Joon Kim,, Gi-Tae Lim,, Jaedong Kim,, Kiwook Lee,, Young-Bae Park,, Young-Chang Joo,

Year:

2008

Language:

english

File:

PDF, 1.34 MB

english, 2008

18

[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Reliability of Cu pillar bump for flip chip and 3-D SiP

Byoung-Joon Kim,, Gi-Tae Lim,, Jaedong Kim,, Kiwook Lee,, Young-Bae Park,, Young-Chang Joo,

Year:

2008

Language:

english

File:

PDF, 1023 KB

english, 2008

19

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Dominant Migration Element in Electrochemical Migration of Eutectic SnPb Solder Alloy

Shin-Bok Lee,, Ja-Young Jung,, Young-Ran Yoo,, Young-Bae Park,, Young-Sik Kim,, Young-Chang Joo,

Year:

2006

Language:

english

File:

PDF, 1.03 MB

english, 2006

20

[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Effects of dopings on the electric-field-induced atomic migration and void formation in Ge2Sb2Te5

Yang, Tae-Youl, Cho, Ju-Young, Yong-Jin Park,, Joo, Young-Chang

Year:

2011

Language:

english

File:

PDF, 565 KB

english, 2011

21

Highly Reliable Ag Nanowire Flexible Transparent Electrode with Mechanically Welded Junctions

Hwang, Byungil, Shin, Hae-A-Seul, Kim, Taegeon, Joo, Young-Chang, Han, Seung Min

Journal:

Year:

2014

Language:

english

File:

PDF, 1.68 MB

english, 2014

22

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Effect of initial anodic dissolution current on the electrochemical migration phenomenon of Sn solder

Lee, Shin-Bok, Jung, Min-Suk, Lee, Ho-Young, Joo, Young-Chang

Year:

2009

Language:

english

File:

PDF, 1003 KB

english, 2009

23

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Current stressing effects on the reliability of Cu pillar bump with shallow solder

Kim, Byoung-Joon, Myeong-Hyeok Jeong,, Jae-Won Kim,, Kiwook Lee,, Jaedong Kim,, Park, Young-Bae, Ohsung Song,, Joo, Young-Chang

Year:

2010

Language:

english

File:

PDF, 405 KB

english, 2010

24

Effects of Metal Electrode on the Electrical Performance of Amorphous In–Ga–Zn–O Thin Film Transistor

Yim, Jung-Ryoul, Jung, Sung-Yup, Yeon, Han-Wool, Kwon, Jang-Yoen, Lee, Young-Joo, Lee, Je-Hun, Joo, Young-Chang

Journal:

Japanese Journal of Applied Physics

Year:

2012

Language:

english

File:

PDF, 576 KB

english, 2012

25

Improved Battery Performance of Nano-crystalline Si Anodes Utilized by Radio Frequency (RF) Sputtered Multifunctional Amorphous Si Coating Layers

Ahn, In-Kyoung, Lee, Young-Joo, Na, Sekwon, Lee, So-Yeon, Nam, Dae-Hyun, Lee, Ji-Hoon, Joo, Young-Chang

Journal:

ACS Applied Materials & Interfaces

Year:

2018

Language:

english

File:

PDF, 2.48 MB

english, 2018

26

Composition, Microstructure and Electrical Performances of Sputtered SnO Thin Film for p-Type Oxide Semiconductor

Lee, Seung Jun, Jang, Yoon Jin, Kim, Han Joon, Hwang, Eun Suk, Jeon, Seok Min, Kim, Jun Shik, Moon, Taehwan, Jang, Kyung-Tae, Joo, Young-Chang, Cho, Deok-Yong, Hwang, Cheol Seong

Journal:

ACS Applied Materials & Interfaces

Year:

2018

Language:

english

File:

PDF, 17.44 MB

english, 2018

27

Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue

Yi, Seol-Min, Choi, In-Suk, Kim, Byoung-Joon, Joo, Young-Chang

Journal:

Electronic Materials Letters

Year:

2018

Language:

english

File:

PDF, 2.89 MB

english, 2018

28

A Stretchable Ionic Diode from Copolyelectrolyte Hydrogels with Methacrylated Polysaccharides

Lee, Hae-Ryung, Woo, Jaesung, Han, Seok Hee, Lim, Seung-Min, Lim, Sungsoo, Kang, Yong-Woo, Song, Won Jun, Park, Jae-Man, Chung, Taek Dong, Joo, Young-Chang, Sun, Jeong-Yun

Journal:

Advanced Functional Materials

Year:

2018

Language:

english

File:

PDF, 2.39 MB

english, 2018

29

Auxetic elastomers: Mechanically programmable meta-elastomers with an unusual Poisson’s ratio overcome the gauge limit of a capacitive type strain sensor

Lee, Young-Joo, Lim, Seung-Min, Yi, Seol-Min, Lee, Jeong-Ho, Kang, Sung-gyu, Choi, Gwang-Mook, Han, Heung Nam, Sun, Jeong-Yun, Choi, In-Suk, Joo, Young-Chang

Journal:

Extreme Mechanics Letters

Year:

2019

Language:

english

File:

PDF, 1.62 MB

english, 2019

30

Selective crack suppression during deformation in metal films on polymer substrates using electron beam irradiation

Lee, So-Yeon, Park, Kyung Ryoul, Kang, Sung-gyu, Lee, Ji-Hoon, Jeon, Eun-chae, Shim, Cheol-Hwee, Ahn, Jae-Pyoung, Kim, Dong-Ik, Han, Heung Nam, Joo, Young-Chang, Kim, Changsoon, Choi, In-Suk

Journal:

Nature Communications

Year:

2019

File:

PDF, 2.08 MB

2019

31

Computational wrapping: A universal method to wrap 3D-curved surfaces with nonstretchable materials for conformal devices

Lee, Yu-Ki, Xi, Zhonghua, Lee, Young-Joo, Kim, Yun-Hyeong, Hao, Yue, Choi, Hongjin, Lee, Myoung-Gyu, Joo, Young-Chang, Kim, Changsoon, Lien, Jyh-Ming, Choi, In-Suk

Journal:

Science Advances

Year:

2020

File:

PDF, 3.09 MB

2020

32

Etching characteristics of photoresist and low-k dielectrics by Ar/O2 ferrite-core inductively coupled plasmas

Hyoun Woo Kim, Jong Woo Lee, Woon Suk Hwang, Beom Hoan O, Seung Gol Lee, Se-Geun Park, Joohee Kim, Duck Jin Chung, Sung Pil Chang, Young-Chang Joo, Junghoon Joo, Chin Wook Chung, Wan Jae Park, Chang-J

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 152 KB

english, 2008

33

Microstructure and electrical properties of high power laser thermal annealing on inkjet-printed Ag films

Yo Han Yoon, Seol-Min Yi, Jung-Ryoul Yim, Ji-Hoon Lee, George Rozgonyi, Young-Chang Joo

Journal:

Microelectronic Engineering

Year:

2010

Language:

english

File:

PDF, 458 KB

english, 2010

34

A model for power law creep controlled hillock growth

Lucas A. Berla, Young-Chang Joo, William D. Nix

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 368 KB

english, 2008

35

Stress-induced surface damage and grain boundary characteristics of sputtered and electroplated copper thin films

Hyun Park, Soo-Jung Hwang, Young-Chang Joo

Journal:

Acta Materialia

Year:

2004

Language:

english

File:

PDF, 274 KB

english, 2004

36

Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na2SO4 solutions

Ja-Young Jung, Shin-Bok Lee, Young-Chang Joo, Ho-Young Lee, Young-Bae Park

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 462 KB

english, 2008

37

Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI

Jong-Min Paik, Il-Mok Park, Young-Chang Joo

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 138 KB

english, 2006

38

Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board

Shin-Bok Lee, Young-Ran Yoo, Ja-Young Jung, Young-Bae Park, Young-Sik Kim, Young-Chang Joo

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 442 KB

english, 2006

39

Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability

Seol-Min Yi, Jung-Uk An, Sang-Soo Hwang, Jung Ryoul Yim, Yong-Hak Huh, Young-Bae Park, Young-Chang Joo

Journal:

Thin Solid Films

Year:

2008

Language:

english

File:

PDF, 717 KB

english, 2008

40

Stress relaxation during isothermal annealing in electroplated Cu films

Soo-Jung Hwang, Young-Chang Joo, Junichi Koike

Journal:

Thin Solid Films

Year:

2008

Language:

english

File:

PDF, 1020 KB

english, 2008

41

Thermomechanical properties and mechanical stresses of Ge2Sb2Te5 films in phase-change random access memory

Il-Mok Park, Jung-Kyu Jung, Sang-Ouk Ryu, Kyu-Jeong Choi, Byoung-Gon Yu, Young-Bae Park, Seung Min Han, Young-Chang Joo

Journal:

Thin Solid Films

Year:

2008

Language:

english

File:

PDF, 421 KB

english, 2008

42

A new technique to measure through film thickness fracture toughness

Ting Y. Tsui, Young-Chang Joo

Journal:

Thin Solid Films

Year:

2001

Language:

english

File:

PDF, 1.39 MB

english, 2001

43

Impurity redistributions in electroplated Cu films during self-annealing

Min-Seung Yoon, Young-Joon Park, Young-Chang Joo

Journal:

Thin Solid Films

Year:

2002

Language:

english

File:

PDF, 392 KB

english, 2002

44

Electromigration damage in mechanically deformed Al conductor lines: dislocations as fast diffusion paths

S.P. Baker, Young-Chang Joo, M.P. Knauß, E. Arzt

Journal:

Acta Materialia

Year:

2000

Language:

english

File:

PDF, 429 KB

english, 2000

45

Mechanical properties and microstructures of Al-Cu Thin films with various heat treatments

Young-Chang Joo

Journal:

Metals and Materials International

Year:

1998

Language:

english

File:

PDF, 1.59 MB

english, 1998

46

Effect of grain boundary energy on surface-energy induced abnormal grain growth in columnar-grained film

Jung-Kyu Jung, Nong-Moon Hwang, Young-Joon Park, Young-Chang Joo

Journal:

Metals and Materials International

Year:

2002

Language:

english

File:

PDF, 681 KB

english, 2002

47

Relationship between grain structures and texture of damascene Cu lines

Jong-Min Paik, Ki-Chul Park, Young-Chang Joo

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 346 KB

english, 2004

48

Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness

Jung-Kyu Jung, Nong-Moon Hwang, Young-Joon Park, Young-Chang Joo

Journal:

Journal of Electronic Materials

Year:

2005

Language:

english

File:

PDF, 322 KB

english, 2005

49

In-Situ Observation of Electromigration in Eutectic SnPb Solder Lines: Atomic Migration and Hillock Formation

Min-Seung Yoon, Min-Ku Ko, Oh-Han Kim, Young-Bae Park, William D. Nix, Young-Chang Joo

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 341 KB

english, 2007

50

Foreword

Sinn-wen Chen, Srinivas Chada, Chih-ming Chen, A. Lindsay Greer, Young-chang Joo, Hyuck Mo Lee, Daniel J. Lewis, Katsuaki Suganuma

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 69 KB

english, 2007